Laser processing technology has three levels in accordance with the size of the processed material and the processing accuracy requirements: Large-scale material laser processing technology based on medium and thick plates, and the processing accuracy is generally millimeter or sub-millimeter level; For Precision laser processing based on thin plates, the processing accuracy is generally in the order of ten microns; The laser microfabrication technology based on various thin films with a thickness of less than 100 microns generally has a processing accuracy of less than ten microns or even sub-micron. The following mainly introduces precision laser processing.
Laser precision processing can be divided into four types of applications, namely precision cutting, precision welding, precision drilling and surface treatment. Under the current technological development and market environment, the application of laser cutting and welding is more popular, and it is most widely used in the fields of 3C electronics and new energy batteries.
|Application type||Processing characteristics||Typical applications|
|Laser precision cutting||fast speed, smooth and flat cut, generally does not require subsequent processing; smaller heat affected zone, and less plate deformation; high processing accuracy, good repeatability, and no damage to the surface of the material.||Laser cutting of PCB plates, microelectronic circuit templates and brittle materials|
|Laser precision welding||No need for electrodes and filler materials, so it is non-contact welding. can weld refractory metals and materials of different thickness.||Laser welding of cameras, sensors and power batteries|
|Laser precision drilling||Punch holes with small diameter in materials with high hardness, brittle or soft texture; fast processing speed and high efficiency||PCB plates and brittle materials such as glass|
|Laser surface treatment||No need for additional materials; Only change the structure of the surface layer of the processed material, and the processed part has minimal deformation; Suitable for surface marking and high-precision parts processing||
cleaning, shock hardening
laser cladding, electroplating, alloying, and vapor deposition