Microcontaminants on electronic circuit boards can reduce electronic efficiency and cause electronic circuit board damage. With the development of science and technology, semiconductors and microelectronic equipment are getting smaller and smaller, and the particles that need to be cleaned are getting smaller and smaller. Cleaning is very difficult. Traditional water washing and ultrasonic cleaning have their shortcomings. Laser cleaning brings new hope and becomes the Best way to clean.
Polyimide film is an important material in electronic components. It is a dielectric material for the internal link structure of multi-layer packaging films for high-speed and high-density electronic components. However, it is often covered with some particulate pollutants, including titanium particles, Chromium particles, tungsten particles, nickel particles, etc. These contaminants need to be cleaned to ensure the normal operation of the polyimide film. Dunlei Laser Rust Removal Machine Company once conducted an experiment to clean polyimide films, using an excimer laser, selecting a laser with a wavelength of 235 nanometers, a pulse of 20ns, a laser energy density of 80mj/cm2, and an automated robot operation method. The cleaning efficiency is extremely high. After cleaning, it is found that the cleaning effect is excellent. The pollutant removal rate detected by the spectrometer is more than 95%, which has reached the required standards and the cleaning efficiency is high. "Why not 100% decontamination? Why is there 5% left? Can't it be removed?", "Indeed, there is still 5% that has not been removed, but this does not mean that it cannot be removed. The main reason is time and efficiency. , in the complete decontamination time, 95% can be removed 50% of the time, and the remaining 5% can be removed in the other 50% of the time. In actual operations, cleaning efficiency and cleaning cost are more important." Explain the theory and practice There is still a certain gap. There is always a delicate balance between efficiency, effect, and cost in practical applications. Generally speaking, ordinary electronic components can remove 95% of contaminants, which is an excellent cleaning effect.
There are many other applications of laser in the cleaning of electronic components, such as cleaning of electronic circuit boards, cleaning of silicon wafers, cleaning of integrated circuits, cleaning of flexible circuits, cleaning of optoelectronic devices, etc. With the development of science and technology, these materials As the integration level increases, there are more and more pins, and the holes are getting smaller and smaller. Traditional cleaning methods are difficult to work with. Laser cleaning can effectively remove the surface of electronic components due to its high accuracy, easy automation, adjustable parameters, and high cleaning efficiency. of dust, grease, oxides, and other particles, they are effectively improving the durability of electronic components. Laser cleaning provides an effective and reliable technology for the microelectronics industry when the small device size and fine particles are difficult to clean. At the same time, laser cleaning does not cause wear and corrosion of the base material, meets environmental protection requirements, and can operate in a narrow space. It is unmatched by any other cleaning process.
Laser cleaning meets environmental protection requirements and meets the needs of sustainable development. As the cost of laser cleaning becomes lower and lower, laser cleaning of electronic components is accepted by more companies.